Shanghai Chiteng New Material Technology Co., Ltd. Manager Huang 13822254266

CT-8113 anti poisoning power potting glue

The glue is a two-component, thermally-conductive, poison-resistant addition-encapsulating silicone rubber. Low viscosity, good thermal conductivity and fluidity , room temperature and heat curing; high temperature aging resistance; rubber elasticity in a wide temperature range ( -60 to 250 °C) after curing, excellent insulation performance, good The waterproof moisture and anti-aging properties.

A typical use

The encapsulation and protection of general electronic components, power modules and circuit boards, as well as the encapsulation of various electronic appliances, such as automotive HID lamp module power supply, automotive ignition system module power supply, and network transformers.

Second, the main performance and technical indicators

colour:                                White, black, gray

Mixing weight ratio:                       A: B=1:1

A component viscosity (cps) : 3800

B component viscosity (cps) :                  2500

Operating time ( min , 25 °C): 120

Curing time ( h , 25 °C): 24

Curing time ( h , 80 °C) 25

Thermal conductivity ( W/mK ): 0.8

Flame retardant grade V-0

Hardness ( Shore-A ): 65

Dielectric Strength ( KV/mm ): 21

Volume resistivity ( Ω· cm) : 1.0 × 1015

Third, the use of methods

Before mixing: A and B components are fully stirred manually or mechanically to avoid changes in properties due to sedimentation.

Mixing: Accurately weigh the two sets of ingredients in a clean container and stir well.

Deaeration: natural deaeration and vacuum deaeration, natural deaeration: the mixed rubber is allowed to stand for 20-30 minutes, vacuum deaeration: vacuum degree 0.08-0.1MPa , vacuum 5-10 minutes.

Infusion: The sizing should be completed within the operating time, otherwise it will affect the leveling. The surface of the substrate is kept clean and dry before potting.

Curing: Room temperature or heat curing can be. The curing speed of the glue has a great relationship with the curing temperature. It takes a long time to cure in the winter, and it is recommended to use the heating method for curing.

Fourth, pay attention to matters

Keep away from children.

Sealed material storage. The mixed compound is used up once to avoid wastage.

The adhesive will not cure when exposed to a certain amount of the following chemicals:

N, P , S organic compounds.

• Ionic compounds such as Sn, Pb , Hg , and As .

Alkynes and poly vinyl compounds.

In order to avoid the above phenomenon, when using on the circuit board, wipe the residual rosin as much as possible, and try to use low-lead solder.

For product safety information, please refer to the product MSDS .

This product is stored in a cool, dry place at 8-28°C . The storage period is 9 months.

Fifth, packaging specifications

A component: 10kg/ barrel; B component: 10kg/ barrel.